Atomic Layer Deposition (ALD) is an advanced deposition technique enabling the precise and controlled deposition of ultra-thin films, typically a few nanometers thick. ALD excels in offering exceptional thickness control and uniformity, making it particularly suitable for coating high-aspect-ratio 3D structures. This technique relies on self-limiting surface reactions, leading to minimal pin-hole and particle levels, contributing to its applicability across diverse fields.
The precise control over film and interface, coupled with high-quality production, makes ALD highly desirable across diverse applications. ALD's advantages, including excellent uniformity, consistent film thickness on complex shapes, and low-temperature processing, make it ideal for various applications in microelectronics, nanotechnology, and biotechnology, especially when dealing with soft substrates like organic and biological samples.