Building the Next Generation of X-ray Inspection for Advanced Packaging
Partnership & Collaboration Opportunities
We are seeking strategic partners to participate in this next phase of development, including:
- Semiconductor manufacturers
- Advanced packaging service providers
- Equipment and system integration partners
- Strategic investors with deep-tech focus
Potential collaboration models include:
- Joint development programs
- Application-driven system validation
- Technology integration partnerships
- Strategic investment discussions (private, case-by-case)
Why This Matters Now
Advanced packaging technologies such as HBM, 2.5D/3D integration, and heterogeneous integration are pushing inspection requirements beyond the limits of conventional X-ray systems.
Key challenges include:
- Detection of sub-micron defects (e.g., TSV voids, micro-bump issues)
- High-throughput inspection for production environments
- Maintaining low radiation dose for sensitive structures
Existing solutions often force trade-offs between resolution, speed, and cost.
MUST is designed to eliminate these trade-offs.
Current Development Focus: Sub-Micron TSV Inspection
We are actively validating imaging capability targeting ~1 µm TSV structures, with ongoing system optimization for:
- High-contrast defect detection
- Multi-angle sparse-view reconstruction
- AI-enhanced image quality improvement
This effort represents a critical step toward enabling true inline 3D inspection at sub-micron scale.
Demo System Initiative
To accelerate real-world validation, SGService is preparing a dedicated demo system aimed at collaboration with leading semiconductor manufacturers and advanced packaging ecosystem partners.
This demo platform is intended to:
- Validate performance on real customer samples
- Demonstrate high-throughput 3D inspection capability
- Enable joint application development for next-generation inspection workflows
We are currently engaging with top-tier semiconductor stakeholders to align system capability with industry needs.
Partnership & Collaboration Opportunities
We are seeking strategic partners to participate in this next phase of development, including:
- Semiconductor manufacturers
- Advanced packaging service providers
- Equipment and system integration partners
- Strategic investors with deep-tech focus
Potential collaboration models include:
- Joint development programs
- Application-driven system validation
- Technology integration partnerships
- Strategic investment discussions (private, case-by-case)
Our Vision
To become the global leader in bringing synchrotron-level X-ray capability into semiconductor fabs, enabling:
- Full-area, high-speed 3D inspection
- Real-time defect detection
- Data-driven process optimization
Get in Touch
If you are interested in exploring collaboration, partnership, or strategic engagement, we welcome a direct conversation.
Contact us for:
- Technical discussions
- Demo system collaboration
- Strategic partnership opportunities
Email: support@sgservice.com.tw